IC UFS3.1 256GB 11.5X13X0.8 Samsung FBGA-153ball

Product number:
AKLUEG8UHDC-B0E1000
EAN:
Manufacturer no.:
KLUEG8UHDC-B0E1000

Price on request

Product information "IC UFS3.1 256GB 11.5X13X0.8 Samsung FBGA-153ball"
RoHS Compliant (Lead-Free&Halogen-Free) mobile temperature grade -25°C to +85°C Tray
Applikation: Embedded / Industrial
Kapazität: 256
Abmessungen: 11.50 X 13,00 X 0.80
Chiphersteller: Samsung
VPE: Tray
Gehäuse: FBGA-153ball
RoHS-Konform: Ja
Technologie: UFS3.1
Temperaturbereich: -25°C - 85

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